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| FDG6316P December 2001 FDG6316P P-Channel 1.8V Specified PowerTrench MOSFET General Description This P-Channel 1.8V specified MOSFET uses Fairchild's advanced low voltage PowerTrench process. It has been optimized for battery power management applications. Features * -0.7 A, -12 V. RDS(ON) = 270 m @ VGS = -4.5 V RDS(ON) = 360 m @ VGS = -2.5 V RDS(ON) = 650 m @ VGS = -1.8 V Applications * Battery management * Load switch * Low gate charge * High performance trench technology for extremely low RDS(ON) * Compact industry standard SC70-6 surface mount package D G S S 1 or 4 G 2 or 5 D 3 or 6 6 or 3 D 5 or 2 G 4 or 1 S Pin 1 S G D SC70-6 The pinouts are symmetrical; pin 1 and pin 4 are interchangeable. Absolute Maximum Ratings Symbol VDSS VGSS ID PD TJ, TSTG Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed TA=25oC unless otherwise noted Parameter Ratings -12 8 (Note 1) Units V V A W C -0.7 -1.8 0.3 -55 to +150 Power Dissipation for Single Operation (Note 1) Operating and Storage Junction Temperature Range Thermal Characteristics RJA Thermal Resistance, Junction-to-Ambient (Note 1) 415 C/W Package Marking and Ordering Information Device Marking .16 Device FDG6316P Reel Size 7'' Tape width 8mm Quantity 3000 units 2001 Fairchild Semiconductor Corporation FDG6316P Rev D W) FDG6316P Electrical Characteristics Symbol BVDSS BVDSS TJ IDSS IGSSF IGSSR VGS(th) VGS(th) TJ RDS(on) TA = 25C unless otherwise noted Parameter Test Conditions Min -12 Typ Max Units V Off Characteristics Drain-Source Breakdown VGS = 0 V, ID = -250 A Voltage Breakdown Voltage Temperature ID = -250 A, Referenced to 25C Coefficient Zero Gate Voltage Drain Current VDS = -10 V, VGS = 0 V Gate-Body Leakage, Forward Gate-Body Leakage, Reverse (Note 2) -3.7 -1 -100 100 -0.4 -0.6 2 221 297 427 250 -1.8 2.5 270 360 650 348 -1.5 mV/C A nA nA V mV/C m VGS = -8 V, VGS = 8 V, VDS = 0 V VDS = 0 V ID = -250 A On Characteristics Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance VDS = VGS, ID = -250 A, Referenced to 25C VGS = -4.5 V, VGS = -2.5 V, VGS = -1.8 V, VGS = -4.5 V, VGS = -4.5 V, VDS = -5 V, ID = -0.7 A ID = -0.5 A ID = -0.4 A ID = -0.7 A, TJ=125C VDS = -5 V ID = -0.7 A ID(on) gFS A S Dynamic Characteristics Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS VSD Input Capacitance Output Capacitance Reverse Transfer Capacitance (Note 2) VDS = -6 V, f = 1.0 MHz V GS = 0 V, 146 60 48 pF pF pF 10 23 16 4 2.4 ns ns ns ns nC nC nC -0.25 A V Switching Characteristics Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD = -6 V, ID = 1 A, VGS = -4.5 V, RGEN = 6 5 13 8 2 VDS = -6 V, VGS = -4.5 V ID = -0.7 A, 1.7 0.3 0.4 Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VGS = 0 V, IS = -0.25 A(Note 2) -0.7 -1.2 Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of PCB on still air environment the drain pins. RJC is guaranteed by design while RJA is determined by the user's board design. RJA = 415C/W when mounted on a minimum pad of FR-4 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0% FDG6316P Rev D (W) FDG6316P Typical Characteristics 2 3 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE VGS=-4.5V -2.5V -2.0V -1.8V 2.6 2.2 1.8 1.4 1 0.6 VGS=-1.5V -ID, DRAIN CURRENT (A) 1.5 1 -1.5V -1.8V -2.0V -2.5V -3.0V -4.5V 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 -VDS, DRAIN TO SOURCE VOLTAGE (V) 0 0.5 1 -ID, DRAIN CURRENT (A) 1.5 2 Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.75 RDS(ON), ON-RESISTANCE (OHM) 1.4 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 1.3 1.2 1.1 1 0.9 0.8 0.7 -50 ID = -0.7A VGS = -4.5V ID = -0.4A 0.65 0.55 0.45 0.35 TA = 125oC TA = 25oC 0.25 0.15 -25 0 25 50 75 100 o 125 150 1 2 3 4 5 TJ, JUNCTION TEMPERATURE ( C) -VGS, GATE TO SOURCE VOLTAGE (V) Figure 3. On-Resistance Variation with Temperature. 2 VDS = -5V -ID, DRAIN CURRENT (A) -IS, REVERSE DRAIN CURRENT (A) Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 10 TA = -55oC 25oC -125oC VGS = 0V 1 TA = 125oC 0.1 25oC -55oC 0.001 1.5 1 0.01 0.5 0 0.5 1 1.5 2 -VGS, GATE TO SOURCE VOLTAGE (V) 0.0001 0 0.2 0.4 0.6 0.8 1 1.2 -VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDG6316P Rev D (W) FDG6316P Typical Characteristics 5 -VGS, GATE-SOURCE VOLTAGE (V) 250 ID = -0.7A VDS = -4V -8V -6V CAPACITANCE (pF) 4 200 CISS 150 f = 1 MHz VGS = 0 V 3 2 100 COSS 50 CRSS 1 0 0 0.5 1 Qg, GATE CHARGE (nC) 1.5 2 0 0 2 4 6 8 10 12 -VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gate Charge Characteristics. 10 P(pk), PEAK TRANSIENT POWER (W) Figure 8. Capacitance Characteristics. 10 -ID, DRAIN CURRENT (A) RDS(ON) LIMIT 1 1ms 10ms 100ms 1s 100s 8 SINGLE PULSE RJA = 415C/W TA = 25C 6 0.1 VGS = -4.5V SINGLE PULSE RJA = 415oC/W TA = 25oC DC 4 2 0.01 0.1 1 10 100 -VDS, DRAIN-SOURCE VOLTAGE (V) 0 0.001 0.01 0.1 1 10 100 t1, TIME (sec) Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 1 D = 0.5 0.2 RJA(t) = r(t) * RJA RJA = 415 C/W P(pk) t1 t2 o 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2 0.001 0.0001 0.001 0.01 0.1 t1, TIME (sec) 1 10 100 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1. Transient thermal response will change depending on the circuit board design. FDG6316P Rev D (W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM DISCLAIMER FAST (R) FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench (R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER (R) SMART STARTTM STAR*POWERTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET (R) VCXTM STAR*POWER is used under license FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H4 |
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